Osamura K., Sugano M., Adam M.I.(mdries@hotmail.com), Ishimoto M.
Ключевые слова: HTS, Bi2223/Ag, Bi2223/Ag alloy, Bi2223/Ag alloy, mechanical properties, tensile tests, strain effects, stress effects, composites, experimental results
Kim K., Oh S., Ha D.-W., Shin H.(hsshin@andong.ac.kr), Dizon J.R.
Kim K., Dizon J.R., Oh S.(ssoh@keri.re.kr), Ha D., Shin H.
Osamura K., Sugano M., Ochiai S., Nakamura M., Tanaka M., Adachi T., Hojo M.(hojo_cm@mech.kyoto-u.ac.jp)
Ekin J.W., Li Y., Xiong X., Qiao Y., Reeves J., Knoll A., Lenseth K., Iwasa Y., Civale L., Maiorov B., Suenaga M., Selvamanickam V., Cheggour N., Chen Y., Salagaj T., Weber C., Xie Y.-Y.(yxie@igc.com), Solovyov V., Clickner C., Hou P.
Wessel W.A., Nijhuis A.(a.nijhuis@tnw.utwente.nl), Ilyin Y., Eijnden N.C., ten Kate H.
Ключевые слова: LTS, Nb3Sn, strands, coils, ITER, stress effects, strain effects, tensile tests, experimental results, power equipment
Osamura K., Hojo M., Sugano M., Oh S.S., Ha D.W., Morishita K., Ochiai S., Tanaka M., Ishida T., Doko D., Okuda H.
Ключевые слова: HTS, Bi2223, tapes multifilamentary, tensile tests, fracture behavior, numerical analysis
Osamura K., Semerad R., Itoh K., Prusseit W., Kiyoshi T., Sugano M.(sugano@kuee.kyoto-u.ac.jp)
Ключевые слова: HTS, YBCO, REBCO, REBCO, coated conductors, substrate Hastelloy, tensile tests, fracture behavior, ISD process, buffer layers, mechanical properties, critical current, strain effects, stress effects, microstructure, quench properties, fabrication, experimental results, critical caracteristics
Tachikawa K., Watanabe K., Yamada Y., Koshizuka N., Katagiri K.(katagiri@iwate-u.ac.jp), Kasaba K., Takaya R., Shimura S.
Ключевые слова: MgB2, tapes, wires, stress effects, strain effects, PIT process, tensile tests, mechanical properties, compression, bending process, experimental results, fabrication
Oh S.-S., Shin H.-S.(hsshin@andong.ac.kr), Ko R.-K., Kim K.-H., Dizon J.R.C., Kim T.-Y.
Awaji S., Watanabe K., Miyoshi K., Katagiri K., Meguro S., Nishijima G.(gen@imr.edu), Oguro H.
Mikkonen R., Kovac P., Ahoranta M.(maria.ahoranta@tut.fi), Bukva P., Tarhasaari T.
Murakami M., Sakai N., Sato T., Katagiri K., Sawamura M., Murakami A., Teshima H., Kasaba K.(kasaba@iwate-u.ac.jp), Sato G.
Ключевые слова: HTS, YBCO, REBCO, bulk, tensile tests, bending process, stress effects, thermal stress, cryogenic systems, experimental results
Ключевые слова: HTS, Bi2223/Ag, strain effects, ac losses, tensile tests, stress effects, mechanical properties, experimental results
Muroga T., Nagaya S., Kashima N., Izumi T., Shiohara Y., Watanabe T., Yamada Y., Miyata S., Shikimachi K.
Shigue C.Y., Baldan C.A., Filho E.R., Oliveira U.R.(ruppert@fee.unicamp.br)
Murakami M., Sakai N., Koshizuka N., Katagiri K., Kono T., Iida K., Murakami A., Kaneko T.(kaneko@istec.or.jp)
Ключевые слова: HTS, YBCO, bulk, grain boundaries, mechanical properties, microstructure, fracture behavior, tensile tests, crack formation, fabrication, experimental results, solder
Iwamoto A., Mito T., Murakami M., Katagiri K.(katagiri@iwate-u.ac.jp), Shoji Y., Sawamura M., Murakami A., Teshima H.
Ключевые слова: HTS, YBCO, REBCO, bulk, fabrication, mechanical properties, tensile tests, bending process, stress effects, strain effects, experimental results
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